Omedata Electronics products include standard IC packages. Our capabilities starts from package design, assembly, test, tape and reel, and logistic management services, so our customers enjoy hassle-free services in shorter cycle time, competitive yields, high quality, and consistent process capability. The packages include typical leaded and surface mount packages. We are offeing various type both single and multi chip modules, such as :

PDIP - Plastic Dual Inline Package • Detail information

SOIC/SOJ - Small Outline IC • Detail information

PLCC - Plastic Leaded Chip Carrier • Detail information

TO/SOT - Transistor Outline/Small Out Line Transistor • Detail information

For more information on the package and number of lead, visit the section on our Product Information.

Our MCM Team competency including :
• Dedicated MCM "flexible" manufaturing line
• Seamless transition towards conventional manufacturing
• New product phase review system
• ALR - assembly level reliability monitoring program
• Dedicated equipment pilot line

To complement our packaging capabilities, we also provide full electrical testing services. Our technology roadmap will be continued to meet the need of semiconductor market and we are currently developing package technology and process manufacturing such as Wafer Mapping, Green Compound, Pb Free and Lead Finishing.