Semiconductor Assembly, Packaging and Test at Omedata Electronics

Omedata´s product development initiatives are hinged on meeting the present and anticipating the future market requirements. Omedata actively collaborates with existing customers and analyze carefully where the industry is heading on such important issues as environment, technology roadmaps and investment. These elements are matched together to come up with programs that are efficient and effective.

"Green" Molding Compound Development
Omedata actively monitors and participates in efforts to make a cleaner and greener environment. The company has set-up its molding process to use what the industry called as ´green´ compound. This new material is in house and is ready for customer qualification anytime. For more detailed information, please contact Omedata.

"Lead Free" Plating
In addition to green compound, Omedata has also internally debugged and qualified leadfree process for leadfinish. There are two processes to choose : Ni-Pd Pre-plated Leadframe or Pure Tin Plating.

There has been bias in the industry towards pure tin plating process mainly for economic reasons. Omedata is prepared to handle both if and when the customer decides which to them is preferrable.

For more information, please contact us.

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